LED Industry:


    Exploding worldwide demand for high-brightness blue-lighted LED has driven the development low cost die separation processes. Blue LED is fabricated by GaN grown on a sapphire substrate. Because of the hardness of sapphire and the LED’s industries unstopped demands of cost reduction, UV lasers were introduced for scribing GaN/Sapphire chips. Because of the difficulty of growing GaN over an area greater than 2", the LED producers need to keep shrinking the chip size in order to increase total chips per wafer, as a result, the narrow cut is also essential for this application.